Abstract: The reliability of power module packaging insulation is critical for the stable and safe operation of high-voltage power devices. Within the module packaging, the interface between the ...
Hexagon Robotics and Microsoft will collaborate on adaptive robots for manufacturing and inspection. The companies said the work will support data-driven production and AI-based automation across ...
Google DeepMind is teaming up with Boston Dynamics to give its humanoid robots the intelligence required to navigate unfamiliar environments and identify and manipulate objects—precisely the kinds of ...
Hosted on MSN
India boosts PCB, Li-ion cell and display module manufacturing under electronics component manufacturing scheme
New Delhi [India]: The flagship Electronics Component Manufacturing Scheme (ECMS) is expected to significantly increase domestic capability, resulting in reduced imports in some select components ...
L&T Semiconductor Technologies is expected to outline a partner-led expansion into cellular IoT modules at CES, positioning India as a future manufacturing base and sourcing option in a market long ...
Vikram Solar now has an annual nameplate module production capacity of 9.5GW. Image: Vikram Solar. Indian solar PV manufacturer Vikram Solar has started commercial operations at its 5GW Vallam module ...
The expanded collaboration brings deeper capabilities across Microsoft’s artificial intelligence (“AI”) platforms, as both C3.ai and Microsoft are focused on making enterprise AI easy to use, reliable ...
Semiconductor stocks have been some of the biggest beneficiaries of the artificial intelligence (AI) revolution. While Nvidia gets more of the headlines, the GPU leader relies heavily on outside ...
A blueprint for realizing the promise of digital transformation, the open-source framework features GPU native Ansys Fluent® fluid simulation software that integrates NVIDIA Omniverse libraries and ...
Jakson Group has started work on the first phase of its 6 GW integrated solar ingot-to-module manufacturing facility in Madhya Pradesh, India. The foundation stone for the facility was recently laid ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results