Aehr Test Systems (NASDAQ:AEHR) used a recent presentation to outline its position in semiconductor reliability testing, with ...

ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves the integrated ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

FREMONT, Calif., Nov. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

KISSIMMEE, Fla.--(BUSINESS WIRE)--SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect ...

MUNICH, May 30, 2023 /PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a first-of-its-kind equipment for ...

As of Monday, January 05, Amkor Technology, Inc.’s AMKR share price has surged by 9.02%, which has investors questioning if ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...