Researchers in Sweden have analyzed how roll-bonded PVT collectors can act as secondary heat sources in ground-source heat pumps and have found they provide a better performance than conventional PVT ...

This article discusses a new technique of coupling thermogravimetry to GC in order to automate the event-controlled or continuous characterization of gas emissions from biomass during thermal ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

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