Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...
Veeco Instruments and research organisation imec have jointly developed a manufacturing process that enables the integration ...
Hongyuan Green Energy says it has produced a first batch of 40 µm monocrystalline silicon wafers that support full-size and half-cut formats, with slicing completed using the company’s in-house ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
In the center of this technological transition, Future Leading SiSiC/RBSIC/silcon carbide Cantilever Paddle products are emerging as a key solution for stable wafer handling and continuous kiln ...
Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...
Wolfspeed’s 300mm platform will unify high-volume silicon carbide manufacturing for power electronics with advanced capabilities in high-purity semi-insulating substrates used in optical and RF ...
Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...
This is a fragment of a small silicon wafer, on which are etched several integrated circuitsl, which performed the basic logic of the Apollo Guidance Computer. Creating an integrated circuit was a ...
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