FPT Group on Wednesday announced the establishment of its Advanced Semiconductor Testing and Packaging Plant, making it the ...
SASTRA Deemed University hosts Indo-Taiwan conference on semiconductor packaging and testing, enhancing industry-academia collaboration for India's semiconductor growth.
Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D Semiconductor Packaging Market 3D Semiconductor Packaging Market Dublin, Jan. 27, ...
Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
On January 28, the ceremony of announcing the establishment of the advanced semiconductor testing and packaging plant was held with the participation of Deputy Minister of Science and Technology Bui ...
TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs ...
At the centre of the push is the launch of India Semiconductor Mission (ISM) 2.0, alongside a sharp expansion of the ...
FPT also announced plans to research and develop AI-on-the-edge System-on-Chip (SoC) solutions, aiming to fully master the ...