KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.
The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic ...
This is the third article in a six-part series highlighting the sourcing, engineering, commercial availability, and use of ...
Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...
A San Francisco startup has raised more than $100 million for technology that could upend the global semiconductor industry—if it proves out. Founded by a protégé of investor Peter Thiel, Substrate ...
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