Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

Two-dimensional (2D) materials could potentially be used to develop advanced monolithic integrated circuits. However, despite impressive demonstrations of single devices and simple circuits—in some ...

With the incessant down-scaling of electronics, traditional semiconductors like Si are encountered with insurmountable hurdles to maintain performance increase without bringing about additional issues ...

One of the most promising new materials for photonic integrated circuits (PICs) is lithium niobate on insulator (LNOI). This platform offers a variety of unique optical characteristics, including a ...

Forming circuits involves the use of cylindrical pieces of semiconductor material. These cylinders are sliced into thin, circular pieces known as bare wafers. The bare wafers are then oxidized before ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

(MENAFN- GlobeNewsWire - Nasdaq) According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly ...