Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...
Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding ...
SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ:KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today the launch of Katalyst™, the Company’s leading edge high ...
Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...
Flip-chip is hot, and so are licensing and other development deals tied to the space-saving semiconductor packaging technology, which is seeing growing use in portable and other sophisticated ...
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