Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...
Oechsler AG, a German moldmaker and molder, is developing a unique process in which an LED light strip is produced in one fully automated sequence. One of the key technologies is a new plastics/metal ...
Osram Opto Semiconductors has introduced the new Oslon solder pad packaging concept for its LEDs, allowing light sources from different manufacturers to be combined in one design. The method requires ...
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