The design stage of a product’s life cycle is arguably one of the most crucial decision making periods, as 70 to 80 percent of the overall manufacturing cost can be projected at this stage. Engineers ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

The integration level of a system-on-chip (SoC) is defined in RTL, just like the rest of the design. Historically, RTL has been built through text editors. However, a decade or more ago, the sheer ...

In this comprehensive guide, we explore the top turnkey PCB assembly manufacturers making waves in 2026, examining their capabilities, strengths, and what sets them apart in this competitive landscape ...

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

Some joint-design considerations are universal; others vary with the assembly methods used. Each joining technique has particular design requirements, while certain joint requirements may suggest a ...

The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon ...

[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

It can be easy to take the humble terminal block for granted. Like the steel girder on a bridge, terminal blocks provide necessary structure and stability within the electrical panel. But once they’re ...