CIT Showcases Ultra-Flat Copper Technology, Two-Time CES Innovation Award Winner, at CES 2026

LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...
Semiconductor Engineering

Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging” was published by researchers at ...
The Herald-Mail

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology, CEO Dr. Byung Joon Han speaks to Bloomberg News at the New Economy Forum

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...
Nasdaq

Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...
The Manila Times

FPT announces the establishment of an Advanced Semiconductor Testing and Packaging plant, accelerating the integration of Vietnam's Semiconductor value chain

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...
Semiconductor Engineering

Advanced Packaging: Driving Innovation, Performance, And New System Capabilities

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...