The multiple demands of 3D NAND to enable yield and performance increase in difficulty at each generation. First generation devices, at 24-32 layer pairs, pushed process tools to extremes, going ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Soft lithography facilitates the fabrication of intricate three-dimensional patterns and structures at both microscale and nanoscale dimensions. Diverging from photolithography, a technique commonly ...
As 40-nanometer NAND flash products are prepared for mass production, and as technologies emerge to achieve densities beyond 2 bits per cell (multilevel-cell technology), with 3- and 4-bit/cell ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback